The Latest in Dielectrics for Advanced Process Nodes - SemiWiki
Low dielectric constant polymers for microelectronics - ScienceDirect
Figure 1 | Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
The impact of intermetal dielectric layer and high temperature bake test on the reliability of nonvolatile memory devices | Semantic Scholar
The Latest in Dielectrics for Advanced Process Nodes - SemiWiki
US6451687B1 - Intermetal dielectric layer for integrated circuits - Google Patents
Porous Low-Dielectric-Constant Material for Semiconductor Microelectronics | IntechOpen
MRAM INTEGRATION WITH LOW-K INTER-METAL DIELECTRIC FOR REDUCED PARASITIC CAPACITANCE - diagram, schematic, and image 06
a) Conductive film and inter-layer dielectric thickness for the used... | Download Scientific Diagram
IMD - "Inter-Metal Dielectric" by AcronymsAndSlang.com
Dual-Damascene-Prozess – Wikipedia
Damascene-Prozess – Wikipedia
BEOL (Back End of Line: interconnect process, the second half of wafer processing) 11. Metal-2 | USJC：United Semiconductor Japan Co., Ltd.
Effect of ions presence in the SiOCH inter metal dielectric structure | Semantic Scholar
A representative list of 'dense' intermetal dielectrics (IMD), their... | Download Scientific Diagram
Metal Layer Stack (Metallization Option) Part 1 |VLSI Concepts
MS Thesis
Dielectrics • Dielectrics electrically and - ppt video online download
Dielectric Materials for Microelectronics | SpringerLink
a) Conductive film and inter-layer dielectric thickness for the used... | Download Scientific Diagram
Effects of plasma, temperature and chemical reactions on porous low dielectric films for semiconductor devices.
A manufacturable and reliable low-k inter-metal dielectric using fluorinated oxide (FSG) | Semantic Scholar
